History
1995 Dec. Incorporation Date
1997 Apr. IC Manufacturing Service Line Started
Dec. Received ISO-9002 Certification
1998 Jun. DRAM Chip and Module Product Line Started
2002 Oct. EEPROM Product Line Started
2004 Dec. Flash Memory Card Product Line Started
IPO (list #8143)
2005 Feb. DDR II Modules (Window BGA) Product Line Started
Quick Facts:
Capital Reserves: 36 Million USD (1.2 Billion NT)
Floor Plant/Factory: 46,400 ft2 / 207,000 ft2
Assembly Capacity: 119 Wirebonders & 123 Diebonders